shibosoftwaredev/f1c100s-linux-nema17-stepper-controller

A four-layer NEMA 17 motor-controller PCB combining an Allwinner F1C100S Linux computer, USB‑PD/buck power system, W5500 Ethernet, STM32 real-time motion control, DRV8825 stepper driver, protection/temperature/current telemetry, USB interfaces, and local LED/buzzer diagnostics.

Version
0.4.56
License
unset
Stars
0

reports/solder-process-audit.json

{
  "circuitSha256": "85a7bf612972276f06c233f1f6f5a9ecfeeee0e63d33543bb6b49730c4332d05",
  "approvedForAssembly": false,
  "ordinaryPadDrillIntersections": [],
  "thermalPadDrillIntersections": [
    {
      "part": "U1",
      "pin": 89,
      "layer": "top",
      "via": "pcb_via_161",
      "x": -0.65,
      "y": 6.75,
      "overlapAreaMm2": 0.070657
    },
    {
      "part": "U1",
      "pin": 89,
      "layer": "top",
      "via": "pcb_via_197",
      "x": 1.78,
      "y": 6.75,
      "overlapAreaMm2": 0.070657
    },
    {
      "part": "U1",
      "pin": 89,
      "layer": "top",
      "via": "pcb_via_207",
      "x": 2,
      "y": 5.4,
      "overlapAreaMm2": 0.070657
    },
    {
      "part": "U_PD",
      "pin": 17,
      "layer": "top",
      "via": "pd_ground_0",
      "x": 15,
      "y": 1,
      "overlapAreaMm2": 0.070657
    },
    {
      "part": "U_MOTOR",
      "pin": 29,
      "layer": "top",
      "via": "pcb_via_179",
      "x": -0.95,
      "y": -11.65,
      "overlapAreaMm2": 0.070657
    },
    {
      "part": "U_MOTOR",
      "pin": 29,
      "layer": "top",
      "via": "driver_thermal_0",
      "x": 2.6,
      "y": -12.7,
      "overlapAreaMm2": 0.070657
    },
    {
      "part": "U_MOTOR",
      "pin": 29,
      "layer": "top",
      "via": "driver_thermal_1",
      "x": 3.15,
      "y": -12.7,
      "overlapAreaMm2": 0.070657
    },
    {
      "part": "U_MOTOR",
      "pin": 29,
      "layer": "top",
      "via": "driver_thermal_2",
      "x": 3.7,
      "y": -12.7,
      "overlapAreaMm2": 0.070657
    },
    {
      "part": "U_MOTOR",
      "pin": 29,
      "layer": "top",
      "via": "driver_thermal_3",
      "x": 2.6,
      "y": -11.9,
      "overlapAreaMm2": 0.070657
    },
    {
      "part": "U_MOTOR",
      "pin": 29,
      "layer": "top",
      "via": "driver_thermal_4",
      "x": 3.15,
      "y": -11.9,
      "overlapAreaMm2": 0.070657
    },
    {
      "part": "U_MOTOR",
      "pin": 29,
      "layer": "top",
      "via": "driver_thermal_5",
      "x": 3.7,
      "y": -11.9,
      "overlapAreaMm2": 0.070657
    },
    {
      "part": "U_MOTOR",
      "pin": 29,
      "layer": "top",
      "via": "driver_thermal_6",
      "x": 2.6,
      "y": -11.1,
      "overlapAreaMm2": 0.070657
    },
    {
      "part": "U_MOTOR",
      "pin": 29,
      "layer": "top",
      "via": "driver_thermal_7",
      "x": 3.15,
      "y": -11.1,
      "overlapAreaMm2": 0.070657
    },
    {
      "part": "U_MOTOR",
      "pin": 29,
      "layer": "top",
      "via": "driver_thermal_8",
      "x": 3.7,
      "y": -11.1,
      "overlapAreaMm2": 0.070657
    },
    {
      "part": "U_MOTOR",
      "pin": 29,
      "layer": "top",
      "via": "driver_thermal_9",
      "x": 2.6,
      "y": -10.3,
      "overlapAreaMm2": 0.070657
    },
    {
      "part": "U_MOTOR",
      "pin": 29,
      "layer": "top",
      "via": "driver_thermal_10",
      "x": 3.15,
      "y": -10.3,
      "overlapAreaMm2": 0.070657
    },
    {
      "part": "U_MOTOR",
      "pin": 29,
      "layer": "top",
      "via": "driver_thermal_11",
      "x": -0.85,
      "y": -12.9,
      "overlapAreaMm2": 0.070657
    }
  ],
  "specifiedFilledCappedProcess": true,
  "thermalStencilProcessQualified": false,
  "processSpecificationSha256": "aac2e9e181d04ae3b08341615c4566085c4062fcbbe377e45d61e934c98bc2d4",
  "processSpecification": "manufacturing-process.json",
  "assemblerApprovalRecord": null,
  "caveat": "Filled/capped processing is specified locally, not accepted by a fabricator. Ordinary intersections include partial grazes, not proven solder failures. Exposed thermal pads still need package-specific stencil and double-sided reflow qualification. Tenting is not filling/capping; assembly approval remains false.",
  "ruleSource": "https://jlcpcb.com/help/article/pcb-via-covering"
}