muse/book-reading-clip-lamp

bill-of-materials.csv

Schematic

Reference designators,Quantity per product,Assembly location,Description,Manufacturer,Manufacturer part number,Value / electrical requirements,Package / dimensions,Selection status,Footprint / qualification status,Supplier reference,Primary source / design reference,Notes
U1,1,Head PCB,Wi-Fi/BLE microcontroller module,Espressif,ESP32-S3-WROOM-1U-N16R8,16 MB flash; 8 MB Octal PSRAM; 3.3 V; external antenna,18 x 19.2 mm module,Selected for Rev B engineering prototype; hardware qualification pending,Imported copper audited; all 41 labels corrected; pin26 row offset corrected,JLCPCB C3013946,https://www.espressif.com/sites/default/files/documentation/esp32-s3-wroom-1_wroom-1u_datasheet_en.pdf,Do not connect module pins28-30 (PSRAM). External antenna ANT1 required. Nine pin41 lands must connect to ground. Thermal vias/stencil require review.
U2,1,Head PCB,Li-ion charger with power path,Texas Instruments,BQ24074RGTR,1 cell; 4.2 V charge; nominal 500 mA programmed current,VQFN-16 RGT; 3 x 3 mm plus exposed pad,Selected for Rev B engineering prototype; hardware qualification pending,Exact JLCSearch / EasyEDA C54313 import; verify stencil / thermal process,JLCPCB C54313,https://www.ti.com/lit/ds/symlink/bq24074.pdf,Temperature monitored at remote cell. Current can reduce under input or thermal limiting. Board is not battery protection circuitry.
U3,1,Head PCB,3.3 V buck-boost regulator,Texas Instruments,TPS63021DSJR,Fixed 3.3 V output,VSON-14 DSJ; 3 x 4 mm plus exposed pad,Selected for Rev B engineering prototype; hardware qualification pending,Exact JLCSearch / EasyEDA C202140 import with comb exposed pad,JLCPCB C202140,https://www.ti.com/lit/ds/symlink/tps63021.pdf,Comb-shaped exposed ground copper requires stencil and thermal-via review. Validate regulator transient and switch-node layout.
U4,1,Head PCB,Bottom-port I2S microphone,TDK InvenSense,INMP441ACEZ-R7,3.3 V; I2S digital output,4.72 x 3.76 x 1.00 mm LGA,Prototype only; R7 catalog variant obsolete; replacement needed for production,JLCSearch import; acoustic hole and masked ground escape added; obsolete prototype part,JLCPCB C22379536,https://product.tdk.com/en/search/sw_piezo/mic/mems-mic/info?part_no=INMP441,Exact part availability must be confirmed. Acoustic hole/ring stencil and enclosure seal need assembly review. Replacement microphone requires a new footprint/pin audit.
U5,1,Head PCB,I2S mono speaker amplifier,Analog Devices / Maxim,MAX98357AETE+T,2.5-5.5 V supply; bridge-tied class-D output,TQFN-16; 3 x 3 mm plus exposed pad,Selected for Rev B engineering prototype; hardware qualification pending,Imported footprint and numbered pin map reviewed; assembly qualification pending,JLCPCB C910544,https://www.analog.com/media/en/technical-documentation/data-sheets/MAX98357A-MAX98357B.pdf,Base speaker must connect only between OUTP and OUTN. Neither speaker terminal is ground. Available output power depends on SYS rail and distortion target.
U6,1,Head PCB,Constant-current LED boost driver,Texas Instruments,TPS61165DBVR,Six white LEDs in series; about 15 mA nominal with 13.3 ohm sense resistor,SOT-23-6 DBV,Selected for Rev B engineering prototype; hardware qualification pending,Exact JLCSearch / EasyEDA C58756 import,JLCPCB C58756,https://www.ti.com/lit/ds/symlink/tps61165.pdf,Check actual peak LED current including tolerances and thermal derating. Switch-node routing and stable compensation are not validated by the BOM.
U7,1,Head PCB,USB D+/D- ESD protection,STMicroelectronics,USBLC6-2SC6,Two data-line channels; VBUS clamp reference,SOT-23-6L,Selected for Rev B engineering prototype; hardware qualification pending,Frozen catalog footprint; pin map audited,JLCPCB C7519,https://www.st.com/resource/en/datasheet/usblc6-2.pdf,Use the ST part. Pins1/6 share one data net; pins3/4 the other; pin2 ground; pin5 VBUS. Similar names from other manufacturers are not automatically approved.
J1,1,Head PCB,USB-C USB2.0 receptacle,HRO / Korean Hroparts Elec,TYPE-C-31-M-12,16 contacts; power and USB2.0 data,Right-angle SMT plus four plated shell slots,Selected for Rev B engineering prototype; hardware qualification pending,Manufacturer drawing reviewed; custom footprint; stencil/assembly validation pending,JLCPCB C165948,https://en.krhro.com/Product-Details/726.html,"Frozen dependency with explicit pads. Recommended HRO lands/slots used. Procure exact HRO variant, not an unspecified clone. Enclosure must expose the connector mouth."
J2,1,Head PCB bottom,24-contact camera FPC connector,Hirose,FH12-24S-0.5SH(55),24 x 0.5 mm; bottom contacts; 0.3 mm flex,16.1 x 6.4 x 2.0 mm,Selected; sample mating validation pending,Exact JLCSearch footprint and 3D model,JLCPCB C202112,https://www.hirose.com/product/p/CL0586-0521-0-55,Internal inward-facing connector; confirm latch access and pin1. Pads25/26 are grounded hold-downs.
J3,1,Head PCB,Six-wire solder harness termination,Custom,No purchased connector: PCB solder holes,BAT+; BAT-; NTC; NTC return; SPK+; SPK-,6 x 2.54 mm holes; 1.0 mm drill,Custom harness required,Custom solder holes; strain relief required,,,PCB model uses placeholder MPN SOLDER_HARNESS_6P_2.54. Do not order a part under that name. See HARNESS1 for wires.
L1,1,Head PCB,Buck-boost power inductor,Coilcraft,XFL4020-152MEC,1.5 uH; Isat 4.1 A at 10% drop,4 x 4 mm class shielded SMD,Selected for Rev B engineering prototype; hardware qualification pending,Manufacturer drawing reviewed; custom footprint; stencil/assembly validation pending,,https://www.coilcraft.com/getmedia/50632d43-da1b-4cdb-8ab4-3029cab51df3/xfl4020.pdf,"Current rating quoted is saturation criterion, not an unconditional continuous circuit output rating."
L2,1,Head PCB,LED boost inductor,Coilcraft,LPS5030-103MRC,10 uH; Isat 1.4 A at 10% drop; Irms 1 A at 20 C rise,5 x 5 mm class shielded SMD,Selected for Rev B engineering prototype; hardware qualification pending,Manufacturer drawing reviewed; custom footprint; stencil/assembly validation pending,,https://www.coilcraft.com/getmedia/11b17d19-33b4-4b4c-8f03-09560f682bf1/lps5030.pdf,Peak switch current and temperature need bench validation.
D1,1,Head PCB,LED boost Schottky rectifier,onsemi,MBR0540T1G,40 V; 0.5 A,SOD-123,Selected for Rev B engineering prototype; hardware qualification pending,Exact JLCSearch / EasyEDA C21353 import,JLCPCB C21353,https://www.onsemi.com/pdf/datasheet/mbr0540t1-d.pdf,Verify reverse voltage margin and current at maximum LED load before release.
Q1,1,Head PCB,USB VBUS detector NMOS,Nexperia,"2N7002,215",60 V N-channel; gate1/source2/drain3,SOT-23,Selected for Rev B engineering prototype; hardware qualification pending,Exact JLCSearch / EasyEDA C65189 import,JLCPCB C65189,https://assets.nexperia.com/documents/data-sheet/2N7002.pdf,"Low-current logic detector, not the battery load switch."
SW1; SW2,2,Head PCB,Ask and light momentary buttons,E-Switch,TL3305AF160QG,Normally open SPST; 160 gf actuation; 50 mA at 12 V rating,4.5 x 4.5 mm body; 3.8 mm height; four 1.6 x 1.6 mm SMT lands,Selected for Rev B engineering prototype; hardware qualification pending,Official land pattern and contact pairs reviewed; standalone netlist/placement checks pass,,https://www.e-switch.com/wp-content/uploads/2023/01/TL3305.pdf,Logical pin1 = physical1+2 lower row; logical pin2 = physical3+4 upper row. Pads at x +/-3.6 mm and y +/-1.4 mm. Assembler must confirm part orientation and enclosure actuator fit.
SW3,1,Head PCB,Power enable slide switch,C&K,JS102011SAQN,SPDT; 0.3 A at 6 V contact rating; used for enable signal,Right-angle SMD,Selected for Rev B engineering prototype; hardware qualification pending,Manufacturer drawing reviewed; two locating holes included,JLCPCB C221660,https://www.ckswitches.com/media/1422/js.pdf,Switch controls regulator enable only; it does not isolate the cell/charger. Confirm actuator access in enclosure.
LED1; LED2; LED3; LED4; LED5; LED6,6,Head PCB bottom,Warm-white reading emitters,XINGLIGHT,XL-3216WWC,2800-3400 K; 20 mA absolute maximum; approximately 15 mA nominal design,1206; 3.2 x 1.6 x 0.8 mm,Selected for Rev B engineering prototype; hardware qualification pending,Manufacturer drawing reviewed; custom footprint; stencil/assembly validation pending,JLCPCB C965830,https://atta.szlcsc.com/upload/public/pdf/source/20250225/5C4852FBB913D8AF4C088570026DA85C.pdf,"Pin1 cathode; pin2 anode. Modest output; total page illuminance, CRI suitability and glare are unqualified. Nominal circuit current is not a guarantee of operating-temperature derating compliance."
LED7,1,Head PCB,Yellow-green power indicator,XINGLIGHT,XL-1608SYGC-06,Compatible with 3.3 V and 1 kohm series resistor,0603,Selected engineering part; hardware qualification pending,JLCSearch exact footprint; pin1 cathode / pin2 anode; board rotation180 degrees,JLCPCB C965805,https://www.lcsc.com/product-detail/C965805.html,"This is a power indication in the present circuit, not a hardware camera-on interlock. Explicit polarity mapping; cathode mark faces board +X. "
LED8,1,Head PCB,Orange charge indicator,XINGLIGHT,XL-1608UOC-06,Compatible with SYS (up to 4.4 V) and 1 kohm series resistor,0603,Selected engineering part; hardware qualification pending,JLCSearch exact footprint; pin1 cathode / pin2 anode; board rotation180 degrees,JLCPCB C965800,https://www.lcsc.com/product-detail/C965800.html,Powered from charger SYS rail; charge indication remains available when the 3.3 V regulator is off. Explicit polarity mapping; cathode mark faces board +X. Catalog pad numbering corrected against manufacturer page7 to agree with silk/fab orientation.
R1; R2,2,Head PCB,Chip resistor,TBD,TBD per value,5.1k ohm (k = thousand); 1%; >=0.1 W; <=100 ppm/C,0603,Generic specification; exact MPN pending,Builtin 0603 lands; chosen vendor part still needs qualification,,,Select exact vendor part before purchasing; no resistor supplier SKU is assigned.
R3; R4,2,Head PCB,Chip resistor,TBD,TBD per value,22 ohm (k = thousand); 1%; >=0.1 W; <=100 ppm/C,0603,Generic specification; exact MPN pending,Builtin 0603 lands; chosen vendor part still needs qualification,,,Select exact vendor part before purchasing; no resistor supplier SKU is assigned.
R5,1,Head PCB,Chip resistor,TBD,TBD per value,1.78k ohm (k = thousand); 1%; >=0.1 W; <=100 ppm/C,0603,Generic specification; exact MPN pending,Builtin 0603 lands; chosen vendor part still needs qualification,,,Select exact vendor part before purchasing; no resistor supplier SKU is assigned. Sets nominal fast charge current to about 500 mA.
R6,1,Head PCB,Chip resistor,TBD,TBD per value,1.62k ohm (k = thousand); 1%; >=0.1 W; <=100 ppm/C,0603,Generic specification; exact MPN pending,Builtin 0603 lands; chosen vendor part still needs qualification,,,Select exact vendor part before purchasing; no resistor supplier SKU is assigned.
R7,1,Head PCB,Chip resistor,TBD,TBD per value,46.4k ohm (k = thousand); 1%; >=0.1 W; <=100 ppm/C,0603,Generic specification; exact MPN pending,Builtin 0603 lands; chosen vendor part still needs qualification,,,Select exact vendor part before purchasing; no resistor supplier SKU is assigned.
R8; R14; R15; R16; R25; R27,6,Head PCB,Chip resistor,TBD,TBD per value,100k ohm (k = thousand); 1%; >=0.1 W; <=100 ppm/C,0603,Generic specification; exact MPN pending,Builtin 0603 lands; chosen vendor part still needs qualification,,,Select exact vendor part before purchasing; no resistor supplier SKU is assigned.
R9; R10; R11; R12; R13; R18; R19; R26,8,Head PCB,Chip resistor,TBD,TBD per value,10k ohm (k = thousand); 1%; >=0.1 W; <=100 ppm/C,0603,Generic specification; exact MPN pending,Builtin 0603 lands; chosen vendor part still needs qualification,,,Select exact vendor part before purchasing; no resistor supplier SKU is assigned.
R17,1,Head PCB,Chip resistor,TBD,TBD per value,13.3 ohm (k = thousand); 1%; >=0.1 W; <=100 ppm/C,0603,Generic specification; exact MPN pending,Builtin 0603 lands; chosen vendor part still needs qualification,,,Select exact vendor part before purchasing; no resistor supplier SKU is assigned. Sets LED current: nominal 0.2 V / 13.3 ohm = 15.04 mA.
R20; R21,2,Head PCB,Chip resistor,TBD,TBD per value,470k ohm (k = thousand); 1%; >=0.1 W; <=100 ppm/C,0603,Generic specification; exact MPN pending,Builtin 0603 lands; chosen vendor part still needs qualification,,,Select exact vendor part before purchasing; no resistor supplier SKU is assigned. Battery-divider pair: use matching tolerance and verify ADC calibration.
R22; R23,2,Head PCB,Chip resistor,TBD,TBD per value,1k ohm (k = thousand); 1%; >=0.1 W; <=100 ppm/C,0603,Generic specification; exact MPN pending,Builtin 0603 lands; chosen vendor part still needs qualification,,,Select exact vendor part before purchasing; no resistor supplier SKU is assigned.
R24; R29,2,Head PCB,Chip resistor,TBD,TBD per value,2k ohm (k = thousand); 1%; >=0.1 W; <=100 ppm/C,0603,Generic specification; exact MPN pending,Builtin 0603 lands; chosen vendor part still needs qualification,,,Select exact vendor part before purchasing; no resistor supplier SKU is assigned.
R28,1,Head PCB,Chip resistor,TBD,TBD per value,47k ohm (k = thousand); 1%; >=0.1 W; <=100 ppm/C,0603,Generic specification; exact MPN pending,Builtin 0603 lands; chosen vendor part still needs qualification,,,Select exact vendor part before purchasing; no resistor supplier SKU is assigned.
C1; C18,2,Head PCB,Multilayer ceramic capacitor,TBD,TBD per capacitance/voltage,4.7uF; 10 V; X5R or X7R; +/-20% or better,0603,Generic specification; exact MPN pending,Builtin 0603 lands; exact vendor part pending,,,"Choose exact part and validate effective capacitance after DC bias, temperature and tolerance. Nominal value alone does not qualify the capacitor."
C2; C4; C5; C10; C15,5,Head PCB,Multilayer ceramic capacitor,TBD,TBD per capacitance/voltage,10uF; 10 V; X5R or X7R; +/-20% or better,0603,Generic specification; exact MPN pending,Builtin 0603 lands; exact vendor part pending,,,"Choose exact part and validate effective capacitance after DC bias, temperature and tolerance. Nominal value alone does not qualify the capacitor."
C3; C7; C8; C9,4,Head PCB,Multilayer ceramic capacitor,TBD,TBD per capacitance/voltage,22uF; 10 V; X5R or X7R; +/-20% or better,0805,Generic specification; exact MPN pending,Builtin 0805 lands; exact vendor part pending,,,"Choose exact part and validate effective capacitance after DC bias, temperature and tolerance. Nominal value alone does not qualify the capacitor."
C6; C11; C16; C17; C21,5,Head PCB,Multilayer ceramic capacitor,TBD,TBD per capacitance/voltage,100nF; 10 V; X7R; +/-10%,0603,Generic specification; exact MPN pending,Builtin 0603 lands; exact vendor part pending,,,"Choose exact part and validate effective capacitance after DC bias, temperature and tolerance. Nominal value alone does not qualify the capacitor."
C12,1,Head PCB,Multilayer ceramic capacitor,TBD,TBD per capacitance/voltage,1uF; 10 V; X7R; +/-10%,0603,Generic specification; exact MPN pending,Builtin 0603 lands; exact vendor part pending,,,"Choose exact part and validate effective capacitance after DC bias, temperature and tolerance. Nominal value alone does not qualify the capacitor."
C19,1,Head PCB,Multilayer ceramic capacitor,TBD,TBD per capacitance/voltage,220nF; 10 V; X7R; +/-10%,0603,Generic specification; exact MPN pending,Builtin 0603 lands; exact vendor part pending,,,"Choose exact part and validate effective capacitance after DC bias, temperature and tolerance. Nominal value alone does not qualify the capacitor."
C20,1,Head PCB,Multilayer ceramic capacitor,TBD,TBD per capacitance/voltage,1uF; 50 V; X7R; +/-10%,0805,Generic specification; exact MPN pending,Builtin 0805 lands; exact vendor part pending,,,"Choose exact part and validate effective capacitance after DC bias, temperature and tolerance. Nominal value alone does not qualify the capacitor. LED boost output may reach roughly 20 V during operation; 50 V part specified."
CAM1 (mates J2),1,Head optical assembly,5 MP autofocus sensor/lens on flex,Kai Lap Technologies,KLT-PAA40-OV5640-1B V1.0 ESP32,OV5640-1B; DVP; 2.8 V analog/I/O/AF and 1.5 V core,21.25 mm standard flex; lens8.5 x8.5 x5.07 mm,Selected for samples; quote/MOQ/availability unverified,Supplier specifies FH12-24S-0.5SH; exact camera drawing mapped,Sales@KaiLapTech.com,https://kailaptech.com/product.aspx?id=3122&l1=712,No Adafruit breakout. Order exact version. Pin23 NC; pin24 AFVDD. Focus at page distance and autofocus initialization untested.
ANT1,1,Inside head enclosure,External Wi-Fi antenna and coax lead,TBD,TBD - qualified 2.4 GHz antenna,50 ohm; U.FL / MHF I compatible; target maximum gain <=2.33 dBi,Flexible antenna or other enclosure-qualified form,PART SELECTION AND RF QUALIFICATION PENDING,External; no PCB antenna in WROOM-1U,,https://www.espressif.com/sites/default/files/documentation/esp32-s3-wroom-1_wroom-1u_datasheet_en.pdf,Module ships without antenna. Do not substitute MHF4. Keep antenna clear of metal neck and LED/ground structures; certify final product as applicable.
BAT1,1,Clip base,Protected rechargeable lithium-polymer pack,TBD,TBD - qualified protected pack,1S; 3.7 V nominal; 4.2 V charge; 1500-2000 mAh target; >=2 A discharge and >=500 mA permitted charge,Pouch size selected after base CAD,PART SELECTION AND PACK QUALIFICATION PENDING,External; insulated retained cavity; no PCB cell footprint,,https://www.ti.com/lit/ds/symlink/bq24074.pdf,"Require cell protection, verified lead polarity, strain relief and charge-temperature limits compatible with the actual TS thresholds. Do not substitute LiFePO4 or higher-voltage charge chemistry."
NTC1,1,Attached to battery in clip base,Battery temperature thermistor,Semitec,103AT-2,10 kohm at 25 C; 1%; B25/85 approximately3435 K,Insulated remote bead/lead assembly,Thermistor selected; mounting and cell-temperature limits pending,External two leads to J3 pins3 and4,,https://www.ti.com/lit/ds/symlink/bq24074.pdf,TI reference thermistor; direct TS connection gives approximately0-50 C charge window. Confirm chosen cell permits this full range or redesign temperature gating. Thermally bond to cell with electrical insulation; do not put sensor only in the head.
SPK1,1,Clip base,Enclosed speaker,Same Sky,CES-352577-28L200 (candidate),8 ohm; 2 W nominal,35 x 25 x 7.7 mm enclosed; wire leads,CANDIDATE ONLY; base fit/acoustics/output level pending,External; retain and provide sound outlet,,https://www2.sameskydevices.com/catalog/audio/speakers/miniature-%2810-mm~40-mm%29,"Verify exact current manufacturer drawing and available wire length before purchase. Amplifier does not necessarily deliver2 W from the chosen rail; speaker rating is capacity, not promised output."
HARNESS1,1,Through gooseneck,Six-conductor flex harness,Custom,TBD - assembled wire harness,2 x battery conductors;2 x twisted speaker conductors;2 x NTC conductors,Battery22-24 AWG target; speaker/NTC26-28 AWG target; length from mechanical design,CUSTOM ASSEMBLY; flexibility/current/voltage-drop qualification pending,Solder to J3; insulate joints and add strain relief,,,"Wire gauges are prototype starting points. Verify actual neck inner bore, bend radius, temperature and flex life. Keep speaker negative isolated from ground. Measure voltage drop at peak Wi-Fi/audio load."
PCB1,1,Head PCB,Bare circuit board,Fabricator TBD,Lamp Clip Head Rev B,60 mm round target;4 layers;1.6 mm; double-sided assembly,Custom PCB,ENGINEERING DESIGN; NOT A FABRICATION RELEASE,Routing/stackup/copper/stencil/DFM/reliability qualification pending,,,BOM does not certify manufacturability. Review all project validation reports and unresolved design items before fabrication.
TP1-TP6,6,Head PCB,Bare-copper test pads,PCB feature,No purchased component,1.2 mm pad target,Integrated PCB copper,PCB feature only,No placement item,,,Exclude from assembly purchasing and pick-and-place BOM.
H00; H02; H20; H22,4,Head PCB,Mounting holes,PCB feature,No purchased component,2.2 mm drill target,Integrated PCB holes,PCB feature only,Screw head/standoff clearance needs enclosure review,,,M2 fasteners/standoffs are not yet selected and are not included as purchased items in this list.
U8,1,Head PCB bottom,2.8 V camera LDO,Texas Instruments,TLV75528PDBVR,3.3 V input; 2.8 V output; 500 mA device rating,SOT-23-5,Selected for Rev B; hardware qualification pending,Exact JLCSearch footprint and 3D model,JLCPCB C2868951,https://www.ti.com/lit/ds/symlink/tlv755p.pdf,Validate dissipation and loaded rails. Effective input/output capacitance >=0.47 uF. U9 EN follows CAM2V8; verify sensor sequencing.
U9,1,Head PCB bottom,1.5 V camera LDO,Texas Instruments,TLV75515PDBVR,3.3 V input; 1.5 V output; 500 mA device rating,SOT-23-5,Selected for Rev B; hardware qualification pending,Exact JLCSearch footprint and 3D model,JLCPCB C2867152,https://www.ti.com/lit/ds/symlink/tlv755p.pdf,Validate dissipation and loaded rails. Effective input/output capacitance >=0.47 uF. U9 EN follows CAM2V8; verify sensor sequencing.
U10; U11,2,Head PCB bottom,Camera data/sync buffers,Texas Instruments,SN74LVC244APWR,3.3 V supply; VIH >=2.0 V; camera2.8 V inputs,TSSOP-20,Selected for Rev B; hardware qualification pending,Exact JLCSearch footprint and 3D model,JLCPCB C7668,https://www.ti.com/lit/ds/symlink/sn74lvc244a.pdf,Outputs disabled by CAM_PWDN. Do not substitute 74HC. Verify clock/data skew on hardware.
U12,1,Head PCB bottom,Camera clock/reset/powerdown buffer,Texas Instruments,SN74LVC125APWR,2.8 V supply; inputs tolerate3.3 V,TSSOP-14,Selected for Rev B; hardware qualification pending,Exact JLCSearch footprint and 3D model,JLCPCB C7813,https://www.ti.com/lit/ds/symlink/sn74lvc125a.pdf,Unused channel disabled/input grounded. R33 series termination after XCLK buffer.
U13,1,Head PCB bottom,SCCB bidirectional translator,Texas Instruments,TXS0102DCTR,VCCA2.8 V; VCCB3.3 V; OE referenced to VCCA,SM8 / DCT,Selected for Rev B; hardware qualification pending,Exact JLCSearch footprint and 3D model,JLCPCB C324082,https://www.ti.com/lit/ds/symlink/txs0102.pdf,Internal pull-ups; OE follows camera RESET_N. Verify rise times on assembled flex.
C13,1,Head PCB bottom,Multilayer ceramic capacitor,TBD,TBD per capacitance/voltage,10uF; 10 V; X5R or X7R; +/-20% or better,0603,Generic specification; exact MPN pending,Builtin 0603 lands; exact vendor part pending,,,"Choose exact part and validate effective capacitance after DC bias, temperature and tolerance. Nominal value alone does not qualify the capacitor."
C14,1,Head PCB bottom,Multilayer ceramic capacitor,TBD,TBD per capacitance/voltage,100nF; 10 V; X7R; +/-10%,0402,Generic specification; exact MPN pending,Builtin 0402 lands; exact vendor part pending,,,"Choose exact part and validate effective capacitance after DC bias, temperature and tolerance. Nominal value alone does not qualify the capacitor."
R30; R31,2,Head PCB bottom,Chip resistor,TBD,TBD per value,100k; 1%; >=0.063 W,0402,Generic specification; exact MPN pending,Builtin 0402 lands; exact vendor part pending,,,Camera support network; see schematic and source.
R32,1,Head PCB bottom,Chip resistor,TBD,TBD per value,10k; 1%; >=0.063 W,0402,Generic specification; exact MPN pending,Builtin 0402 lands; exact vendor part pending,,,Camera support network; see schematic and source.
R33,1,Head PCB bottom,Chip resistor,TBD,TBD per value,33; 1%; >=0.063 W,0402,Generic specification; exact MPN pending,Builtin 0402 lands; exact vendor part pending,,,Camera support network; see schematic and source.
C22; C24; C26,3,Head PCB bottom,Multilayer ceramic capacitor,TBD,TBD per value,4.7uF; 10 V; X7R; effective capacitance per regulator requirements,0603,Generic specification; exact MPN pending,Builtin 0603 lands; exact vendor part pending,,,Camera support network; see schematic and source.
C23,1,Head PCB bottom,Multilayer ceramic capacitor,TBD,TBD per value,1uF; 10 V; X7R; effective capacitance per regulator requirements,0603,Generic specification; exact MPN pending,Builtin 0603 lands; exact vendor part pending,,,Camera support network; see schematic and source.
C25; C27; C28; C29; C30; C31,6,Head PCB bottom,Multilayer ceramic capacitor,TBD,TBD per value,100nF; 10 V; X7R; effective capacitance per regulator requirements,0402,Generic specification; exact MPN pending,Builtin 0402 lands; exact vendor part pending,,,Camera support network; see schematic and source.