abse/smartwatch-v1-pcb

mechanical/PUBLICATION_STATUS.md

# Publication status

Published `abse/smartwatch-v1-pcb@0.2.0` at https://tscircuit.com/abse/smartwatch-v1-pcb . The routed board, compact assembly and exploded assembly are in `index.tsx`, `assembly.circuit.tsx` and `assembly-exploded.circuit.tsx`.

The final cloud build `66c32345-c348-4171-a34e-06117b9d9331` completed at 2026-10-10T21:55:13.705Z: all three circuits passed, exit code 0, and registry artifact registration completed without errors. The standalone viewer is https://abse--smartwatch-v1-pcb-v0-2-0.tscircuit.app. Downloaded native circuits match the audited board and all 19 compact/exploded assembly model placements, with zero native errors. Final evidence is `reports/esp32/publication-final.json`; earlier staging reports describe historical upload attempts.

Cloud builds use `npm ci --legacy-peer-deps` to reinstall the pinned npm lockfile, then generate the three native circuits, previews and standalone viewer. Required sources were repaired with compressed uploads after the CLI archive exceeded the request limit. Large model/reference downloads match the staged files byte-for-byte. Generated outputs were rebuilt after earlier registry storage failures; credentials and private chat exports are excluded.

The board is 100% physically connected, with zero native DRC errors and zero detected PCB/Gerber shorts. The mechanical study remains provisional: populated display-flex component and factory-fold dimensions are unavailable, so full 14.5 mm enclosure fit is unqualified. See `ASSEMBLY_STATUS.md`. No fabrication, hardware, RF, Qi/FOD or runtime qualification is claimed.