abse/boostxl-bassensors

docs/order-readiness.md

# First-article release review

## Verdict

**Approved for a small first-article prototype order only.** The electrical design is clean; the breakaway outline and slots remain image-derived until TI's SLAC777 fabrication archive is retrieved through myTI.

## Closed release gates

- TypeScript, build, release audit, and `tsci check shorts` pass with zero generated errors.
- The 25-reference circuit, values, pin maps, and fitted state are checked against SLAU762B Figure 5-1.
- Non-passives are local JLCPCB imports; native passives carry explicit manufacturer and LCSC identifiers.
- The board uses 0.30/0.45 mm via limits and one meaningful TI-style schematic sheet without explicit `<netlabel>` components.
- The main board, six horizontal breakaway slots, vertical coupon separation, and both TMP116 coupon circuits are present.

## Mandatory first-article gates

1. Print the entire panel at 1:1. Measure every board edge, mounting hole, six horizontal slots, vertical breakaway slots, coupon mounting holes, and both connector rows before payment.
2. Retrieve TI archive SLAC777 when myTI access is available and compare its outline, Gerbers, BOM, and copper before any quantity order. The current public download redirects to login, so exact TI fabrication parity is not claimed.
3. Inspect Gerbers, drill/routing files, solder mask, paste, silkscreen, BOM, CPL, and sensor rotations in the board-house viewer. Confirm that every breakaway slot is routed, not drawn only in silkscreen.
4. Order 2–5 panels. Validate 3.3 V current, I²C addressing, OPT3001, HDC2010, TMP116 on-board/coupon paths, DRV5055 analog output, LEDs, and breakaway use.

The first article is meant to validate the provisional mechanics. Do not order quantity until SLAC777 or physical measurements close that gate.