techmannih/nema34-mounted-stepper-controller
A USB-C PD-powered RP2040 motor controller with protected 48 V power, DRV8262 dual-bridge drive for a NEMA34 motor, regenerative-braking resistor, isolated sensing, hardware interlocks, and telemetry/status interfaces.
- Version
- 0.3.113
- License
- unset
- Stars
- 1
engineering/copper-geometry-review.json
{
"architecture": "RP2040_DRV8262DDV",
"board": "dist/manufacturing/kicad-project/pd1180-epr-r0.3.kicad_pcb",
"board_sha256": "90cffb0ec9f0c7970df01fd5e45176ecb00cab87f8b89d7c96397e3385281a6a",
"model_source_sha256": {
"scripts/export-filled-power-copper.py": "293474ca65798cf99077d80e26a465e90792d0f5127b459e1aaeb5a2c474c76b",
"scripts/screen-filled-power-copper.py": "36a02200b7f5e9f29321793762c48f126e3f6fcab7901572057caaa18394966e",
"scripts/test-filled-power-copper.py": "2be758ad54dabc7013fef0f844a65a991c01af8df011103a5231dc8e282212ef"
},
"checked_at": "2026-11-07T04:26:34.848411Z",
"limitation": "Actual refilled native copper at 20 C; DC resistance estimate only, not thermal/current/EMC or fabrication qualification.",
"baseline_board_sha256": "097e7d2f3bbe412744c118c06e71c14a7adf5d1f30942f13ad93497d7300a87a",
"baseline_description": "Exact merged main 5035034 / DATA-only DRV8462DDVR native PCB. Prior verified after-results become this authorized DRV8262DDVR migration comparison baseline.",
"dc_screen": {
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{
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"method": "9-point DC sheet-conductance screening; 35 um copper at 20 C, 20 um via plating, 1.6 mm equally spaced stack",
"limitations": [
"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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"limitations": [
"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
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{
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"limitations": [
"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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"limitations": [
"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
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{
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"limitations": [
"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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"limitations": [
"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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"limitations": [
"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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"limitations": [
"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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"limitations": [
"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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"limitations": [
"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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"limitations": [
"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
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{
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
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},
{
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
}
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"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
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{
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
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]
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{
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]
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{
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]
},
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]
},
{
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]
},
{
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]
},
{
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]
},
{
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"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
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]
},
{
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"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
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]
},
{
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"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
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]
}
],
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],
"revision": "before"
},
{
"net": "MOTOR_A2",
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"to": "J2:2",
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"nodes": 190163,
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"limitations": [
"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
],
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}
]
},
"raw_evidence_archive": "engineering/rp2040-copper-evidence.zip",
"prior_layout_comparison": {
"architecture": "RP2040_DRV8462DDV",
"board": "dist/manufacturing/kicad-project/pd1180-epr-r0.3.kicad_pcb",
"board_sha256": "097e7d2f3bbe412744c118c06e71c14a7adf5d1f30942f13ad93497d7300a87a",
"model_source_sha256": {
"scripts/export-filled-power-copper.py": "293474ca65798cf99077d80e26a465e90792d0f5127b459e1aaeb5a2c474c76b",
"scripts/screen-filled-power-copper.py": "36a02200b7f5e9f29321793762c48f126e3f6fcab7901572057caaa18394966e",
"scripts/test-filled-power-copper.py": "2be758ad54dabc7013fef0f844a65a991c01af8df011103a5231dc8e282212ef"
},
"checked_at": "2026-11-05T07:25:03.215900+00:00",
"limitation": "Actual refilled native copper at 20 C; DC resistance estimate only, not thermal/current/EMC or fabrication qualification.",
"baseline_board_sha256": "0455d7ba01ada4b5635d61e988f82bd3ad80fb59acb2ac50367179bc6c4703c6",
"baseline_description": "Exact merged main fd77f02 native board before the DATA-only, sensor-switch and 2x1000uF bulk ECO. Its previous after-results are retained as this comparison baseline.",
"dc_screen": {
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"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
"net": "MOTOR_A1",
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"to": "R115:1",
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"nodes": 31821,
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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"to": "R116:1",
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"nodes": 7095,
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"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
"net": "MOTOR_B1",
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"to": "R116:1",
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"nodes": 15958,
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"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
"net": "MOTOR_A1_OUT",
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"to": "J2:1",
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"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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"to": "J2:1",
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"nodes": 35677,
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
"net": "MOTOR_A2",
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"to": "J2:2",
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"nodes": 19632,
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
"net": "MOTOR_A2",
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"to": "J2:2",
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"nodes": 44456,
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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"to": "J2:4",
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
"net": "PD_VBUS",
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"to": "Q4:1,2,3",
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
"net": "PD_VBUS",
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"to": "Q4:1,2,3",
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
"net": "EFUSE_IN",
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"to": "U6:1,2",
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"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
"net": "VMOTOR",
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"to": "U7:2,11,12,21",
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"nodes": 115535,
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
"net": "BRAKE_RETURN",
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"to": "Q16:9",
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
"net": "BRAKE_RETURN",
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"to": "Q16:9",
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
}
],
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{
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
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]
},
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]
},
{
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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{
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}
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],
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]
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"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
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"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
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]
},
{
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"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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]
},
{
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]
},
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]
},
{
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"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
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]
},
{
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]
},
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]
},
{
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]
},
{
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]
},
{
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]
},
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]
},
{
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]
},
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]
}
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]
},
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]
},
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]
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"destination_nodes": 2700,
"components": 1,
"board_sha256": "0455d7ba01ada4b5635d61e988f82bd3ad80fb59acb2ac50367179bc6c4703c6",
"method": "9-point DC sheet-conductance screening; 35 um copper at 20 C, 20 um via plating, 1.6 mm equally spaced stack",
"limitations": [
"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
"net": "MOTOR_A2",
"from": "U7:14,15,16",
"to": "J2:2",
"grid_mm": 0.05,
"nodes": 44456,
"resistance_mohm_20c": 21.4948,
"voltage_drop_mv_at_5_5a": 118.221,
"loss_w_at_5_5a": 0.6502,
"source_nodes": 768,
"destination_nodes": 6052,
"components": 1,
"board_sha256": "0455d7ba01ada4b5635d61e988f82bd3ad80fb59acb2ac50367179bc6c4703c6",
"method": "9-point DC sheet-conductance screening; 35 um copper at 20 C, 20 um via plating, 1.6 mm equally spaced stack",
"limitations": [
"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
"net": "MOTOR_B1_OUT",
"from": "R116:2",
"to": "J2:3",
"grid_mm": 0.075,
"nodes": 19909,
"resistance_mohm_20c": 7.9258,
"voltage_drop_mv_at_5_5a": 43.592,
"loss_w_at_5_5a": 0.2398,
"source_nodes": 368,
"destination_nodes": 2700,
"components": 1,
"board_sha256": "0455d7ba01ada4b5635d61e988f82bd3ad80fb59acb2ac50367179bc6c4703c6",
"method": "9-point DC sheet-conductance screening; 35 um copper at 20 C, 20 um via plating, 1.6 mm equally spaced stack",
"limitations": [
"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
"net": "MOTOR_B1_OUT",
"from": "R116:2",
"to": "J2:3",
"grid_mm": 0.05,
"nodes": 44910,
"resistance_mohm_20c": 7.8814,
"voltage_drop_mv_at_5_5a": 43.348,
"loss_w_at_5_5a": 0.2384,
"source_nodes": 840,
"destination_nodes": 6052,
"components": 1,
"board_sha256": "0455d7ba01ada4b5635d61e988f82bd3ad80fb59acb2ac50367179bc6c4703c6",
"method": "9-point DC sheet-conductance screening; 35 um copper at 20 C, 20 um via plating, 1.6 mm equally spaced stack",
"limitations": [
"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
"net": "MOTOR_B2",
"from": "U7:7,8,9",
"to": "J2:4",
"grid_mm": 0.075,
"nodes": 22180,
"resistance_mohm_20c": 8.6664,
"voltage_drop_mv_at_5_5a": 47.665,
"loss_w_at_5_5a": 0.2622,
"source_nodes": 357,
"destination_nodes": 2692,
"components": 1,
"board_sha256": "0455d7ba01ada4b5635d61e988f82bd3ad80fb59acb2ac50367179bc6c4703c6",
"method": "9-point DC sheet-conductance screening; 35 um copper at 20 C, 20 um via plating, 1.6 mm equally spaced stack",
"limitations": [
"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
"net": "MOTOR_B2",
"from": "U7:7,8,9",
"to": "J2:4",
"grid_mm": 0.05,
"nodes": 50298,
"resistance_mohm_20c": 8.5202,
"voltage_drop_mv_at_5_5a": 46.861,
"loss_w_at_5_5a": 0.2577,
"source_nodes": 768,
"destination_nodes": 6052,
"components": 1,
"board_sha256": "0455d7ba01ada4b5635d61e988f82bd3ad80fb59acb2ac50367179bc6c4703c6",
"method": "9-point DC sheet-conductance screening; 35 um copper at 20 C, 20 um via plating, 1.6 mm equally spaced stack",
"limitations": [
"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
"net": "PD_VBUS",
"from": "J1:7,8,17,18",
"to": "Q4:1,2,3",
"grid_mm": 0.075,
"nodes": 57700,
"resistance_mohm_20c": 19.1349,
"voltage_drop_mv_at_5_5a": 105.242,
"loss_w_at_5_5a": 0.5788,
"source_nodes": 240,
"destination_nodes": 594,
"components": 1,
"board_sha256": "0455d7ba01ada4b5635d61e988f82bd3ad80fb59acb2ac50367179bc6c4703c6",
"method": "9-point DC sheet-conductance screening; 35 um copper at 20 C, 20 um via plating, 1.6 mm equally spaced stack",
"limitations": [
"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
"net": "PD_VBUS",
"from": "J1:7,8,17,18",
"to": "Q4:1,2,3",
"grid_mm": 0.05,
"nodes": 129665,
"resistance_mohm_20c": 19.157,
"voltage_drop_mv_at_5_5a": 105.363,
"loss_w_at_5_5a": 0.5795,
"source_nodes": 552,
"destination_nodes": 1248,
"components": 1,
"board_sha256": "0455d7ba01ada4b5635d61e988f82bd3ad80fb59acb2ac50367179bc6c4703c6",
"method": "9-point DC sheet-conductance screening; 35 um copper at 20 C, 20 um via plating, 1.6 mm equally spaced stack",
"limitations": [
"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
"net": "EFUSE_IN",
"from": "Q4:9",
"to": "U6:1,2",
"grid_mm": 0.075,
"nodes": 14183,
"resistance_mohm_20c": 6.8076,
"voltage_drop_mv_at_5_5a": 37.442,
"loss_w_at_5_5a": 0.2059,
"source_nodes": 2928,
"destination_nodes": 72,
"components": 1,
"board_sha256": "0455d7ba01ada4b5635d61e988f82bd3ad80fb59acb2ac50367179bc6c4703c6",
"method": "9-point DC sheet-conductance screening; 35 um copper at 20 C, 20 um via plating, 1.6 mm equally spaced stack",
"limitations": [
"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
"net": "EFUSE_IN",
"from": "Q4:9",
"to": "U6:1,2",
"grid_mm": 0.05,
"nodes": 31874,
"resistance_mohm_20c": 6.7917,
"voltage_drop_mv_at_5_5a": 37.354,
"loss_w_at_5_5a": 0.2054,
"source_nodes": 6552,
"destination_nodes": 168,
"components": 1,
"board_sha256": "0455d7ba01ada4b5635d61e988f82bd3ad80fb59acb2ac50367179bc6c4703c6",
"method": "9-point DC sheet-conductance screening; 35 um copper at 20 C, 20 um via plating, 1.6 mm equally spaced stack",
"limitations": [
"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
"net": "VMOTOR",
"from": "U6:17,18",
"to": "U7:2,11,12,21",
"grid_mm": 0.075,
"nodes": 115535,
"resistance_mohm_20c": 14.1535,
"voltage_drop_mv_at_5_5a": 77.844,
"loss_w_at_5_5a": 0.4281,
"source_nodes": 72,
"destination_nodes": 441,
"components": 1,
"board_sha256": "0455d7ba01ada4b5635d61e988f82bd3ad80fb59acb2ac50367179bc6c4703c6",
"method": "9-point DC sheet-conductance screening; 35 um copper at 20 C, 20 um via plating, 1.6 mm equally spaced stack",
"limitations": [
"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
"net": "VMOTOR",
"from": "U6:17,18",
"to": "U7:2,11,12,21",
"grid_mm": 0.05,
"nodes": 259660,
"resistance_mohm_20c": 14.1072,
"voltage_drop_mv_at_5_5a": 77.59,
"loss_w_at_5_5a": 0.4267,
"source_nodes": 168,
"destination_nodes": 1024,
"components": 1,
"board_sha256": "0455d7ba01ada4b5635d61e988f82bd3ad80fb59acb2ac50367179bc6c4703c6",
"method": "9-point DC sheet-conductance screening; 35 um copper at 20 C, 20 um via plating, 1.6 mm equally spaced stack",
"limitations": [
"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
"net": "VMOTOR",
"from": "U6:17,18",
"to": "J3:1",
"grid_mm": 0.075,
"nodes": 115535,
"resistance_mohm_20c": 15.1211,
"voltage_drop_mv_at_5_5a": 83.166,
"loss_w_at_5_5a": 0.4574,
"source_nodes": 72,
"destination_nodes": 2224,
"components": 1,
"board_sha256": "0455d7ba01ada4b5635d61e988f82bd3ad80fb59acb2ac50367179bc6c4703c6",
"method": "9-point DC sheet-conductance screening; 35 um copper at 20 C, 20 um via plating, 1.6 mm equally spaced stack",
"limitations": [
"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
"net": "VMOTOR",
"from": "U6:17,18",
"to": "J3:1",
"grid_mm": 0.05,
"nodes": 259660,
"resistance_mohm_20c": 15.1359,
"voltage_drop_mv_at_5_5a": 83.247,
"loss_w_at_5_5a": 0.4579,
"source_nodes": 168,
"destination_nodes": 4980,
"components": 1,
"board_sha256": "0455d7ba01ada4b5635d61e988f82bd3ad80fb59acb2ac50367179bc6c4703c6",
"method": "9-point DC sheet-conductance screening; 35 um copper at 20 C, 20 um via plating, 1.6 mm equally spaced stack",
"limitations": [
"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
"net": "BRAKE_RETURN",
"from": "J3:2",
"to": "Q16:9",
"grid_mm": 0.075,
"nodes": 71534,
"resistance_mohm_20c": 6.9792,
"voltage_drop_mv_at_5_5a": 38.385,
"loss_w_at_5_5a": 0.2111,
"source_nodes": 2212,
"destination_nodes": 2928,
"components": 1,
"board_sha256": "0455d7ba01ada4b5635d61e988f82bd3ad80fb59acb2ac50367179bc6c4703c6",
"method": "9-point DC sheet-conductance screening; 35 um copper at 20 C, 20 um via plating, 1.6 mm equally spaced stack",
"limitations": [
"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
},
{
"net": "BRAKE_RETURN",
"from": "J3:2",
"to": "Q16:9",
"grid_mm": 0.05,
"nodes": 160261,
"resistance_mohm_20c": 6.9697,
"voltage_drop_mv_at_5_5a": 38.334,
"loss_w_at_5_5a": 0.2108,
"source_nodes": 4980,
"destination_nodes": 6552,
"components": 1,
"board_sha256": "0455d7ba01ada4b5635d61e988f82bd3ad80fb59acb2ac50367179bc6c4703c6",
"method": "9-point DC sheet-conductance screening; 35 um copper at 20 C, 20 um via plating, 1.6 mm equally spaced stack",
"limitations": [
"Grid approximation; validate mesh convergence and native connectivity separately",
"Ideal terminal contacts; via contacts approximate, copper thickness and barrel plating are assumptions",
"Excludes connector/contact, shunt and transistor resistance, AC/PWM/proximity effects and temperature feedback",
"DC 5.5 A comparison is not a duty-cycle, temperature-rise or current-rating qualification"
]
}
],
"physical_thermal_qualified": false
},
"changes": "Restore the USB return stitch; add two PD transfer vias and a 0.5 mm B.Cu parallel path around the relocated D20 corner. Other power corridors retain the existing rule/width policy."
},
"changes": "DRV8262DDVR plus MCP4822/current references and stocked R60/BZ1/U36/R66 replacements. Preserve motor/brake corridors, Kelvin branches and USB return reference. Add 1.35 mm B.Cu PD parallel conductor, 1.5 mm inner transfer tracks and four power-transfer vias to offset the local U36 routing detour. The export fix adds one 0.60 mm In1.Cu MOTOR_A2 bridge to preserve the filled-copper connection after KiCad refill; its exact geometry and regression evidence are in engineering/motor-a2-export-bridge.json.",
"reference_alignment": {
"previous_board_sha256": "000495f20437bd5cbef3d1ed4b5b1eb64360de8e61818af3300d16093b128255",
"final_board_sha256": "90cffb0ec9f0c7970df01fd5e45176ecb00cab87f8b89d7c96397e3385281a6a",
"change": "Added the exact 0.60 mm In1.Cu MOTOR_A2 bridge from engineering/motor-a2-export-bridge.json; other unfilled native records are preserved.",
"method": "KiCad 10.0.5 refill-save was byte-identical to the reviewed board. Refill-enabled DRC/ERC reports 0 unconnected, parity, or ERC findings; 896 actual filled-copper objects were exported and the 11 named power paths were screened at 0.075/0.05 mm, with 0.025 mm refinement where needed.",
"power_copper_geometry_sha256": "131d06c320e989b8ef5059b6943953d477c23a7d6cd96998780cc1c35e331c67",
"supplier_only_rebind": "R65 supplier code changed to C328424; copper rows and filled geometry re-measured identical to board fca4ed82",
"encoder_via_rebind": "Encoder bypass via at (100.6, 103.9) changed from 0.60/0.30 to 0.45/0.30 mm by user request; copper rows and filled geometry re-measured identical to board 4b39216f",
"c50_and_via_rebind": "Encoder via 0.45/0.30 and C50 moved to XTAL_OUT; power copper rows and filled geometry re-measured identical to board 4b39216f",
"crystal_swap_rebind": "Y1 changed to ABM8-272-T3 and C49/C50 to 15 pF with no copper change; power copper rows and filled geometry re-measured identical to board 4b39216f"
}
}