gokul/usb3-sd-hub

verification/VERIFICATION.md

PCB

Schematic

# Verification — 16 October 2026

**Fabrication release: failed/incomplete.** This package is an engineering draft.

The source is pinned to tscircuit 0.0.2911, capacity-autorouter 0.0.985 and circuit-json 0.0.528. Production-source TypeScript passes. Exactly three schematics are generated without authored schX/schY props. All 229 top-side assembly parts have manufacturer part numbers.

The partial-routing snapshot retains 770 `pcb_port_not_connected_error` records. Its eleven initial pair sections have 22 native PCB trace records. Their clearance, overlap, continuity, bounds, hole clearance and self-short checks pass. Their copper-length skew is no greater than 0.127 mm, and their conservative potential uncoupled runs are below 2 mm. `pair-geometry-check.json` identifies the checked snapshot. These checks cover the completed sections only.

The public preview is built with routing disabled so that it opens reliably; the separately exported partial-routing PCB and GLB contain the actual tracks. Neither view indicates full-board readiness. Unfinished USB connector/USB-A/USB2 sections and other nets must not be sent through unconstrained routing and called valid merely because a solver finishes.

All three schematic exports, the PCB and the mechanical views are inspected. CAD STEP solids are re-imported and checked with OpenCascade. Nominal bodies and supplier alignment still need mechanical qualification. Firmware/configuration, power behavior, assembly orientations and completed-board connectivity remain open.

The diagnostic Gerber archive contains four copper layers and the other artwork/drill/BOM/placement files. Independent inspection parses all 12 Gerber layers with errors raised and checks aperture rotation. Gerbonara preserves the routed slots and retains two G90-header warnings. Parsed Excellon object counts include an initial hit plus a route for each G85 slot and therefore are not a count of distinct physical holes. Parsing is not fabrication DRC.

Through-hole connector lands have no stencil apertures on either side. The two main QFN exposed pads use separate stencil windows totaling 60% nominal coverage; filled/capped via-in-pad processing and assembly review remain required. Pick-and-place rotations are unverified because supplier pin-1 references are missing. The CSVs in the diagnostic archive are not assembly-approved.