gokul/usb-hub-board
A 4-layer 100×66 mm USB 2.0 hub board with a USB‑C upstream port, four protected downstream USB‑C/USB‑A ports, an integrated SD card reader, USB hub controllers, 3.3 V regulation, ESD protection, current-limited power switches, crystal oscillators, and filtering/passive components.
- Version
- 1.0.6
- License
- unset
- Stars
- 1
README.md
PCB
Schematic
# USB-C Male 4-Port USB 2.0 Hub with SD Reader
This private tscircuit package implements a one-cable, bus-powered USB 2.0 hub for a MacBook:
- upstream USB-C male plug carrying both data and power;
- two downstream USB-C receptacles and two USB-A receptacles, all on the right edge;
- full-size push-push SD card socket through a USB2244 reader;
- USB2517I hub controller and four AP22653 protected 500 mA port switches;
- USBLC6-2SC6 ESD protection on every external USB data pair;
- 100 mm × 66 mm, four-layer PCB with blue solder mask and white silkscreen;
- local `auto_local` routing and four automatically arranged schematic sheets without `schX` or `schY`.
The USB-C male connection supplies both USB 2.0 data and 5 V power. The hub, SD reader, and four downstream ports therefore share the current available from the MacBook. The four downstream ports can transfer data and power attached devices, but they do not each have an independent 500 mA power budget when several devices are connected at once.
## Local verification
```bash
bun run typecheck
bun node_modules/tscircuit/cli.mjs check netlist source-entry.tsx
bun node_modules/tscircuit/cli.mjs check source source-entry.tsx
bun run build:local
bun node_modules/tscircuit/cli.mjs check shorts dist/local/usb-hub-board.circuit.json
```
The release route contains zero Circuit JSON errors and passes the netlist, source, placement, routing DRC, and copper-short checks. Exact active parts and connectors are imported from JLCPCB/EasyEDA footprints. Generic passives retain value and footprint information in the BOM.
The fabrication archive is `dist/fabrication/usb-hub-board-gerbers.zip`; it includes four copper layers, solder masks, paste layers, silkscreens, edge cuts, plated and non-plated drill files, BOM, and pick-and-place CSV.
Before a production run, confirm the fabricator's four-layer stack-up and adjust the USB differential-pair width/gap for 90 Ω differential impedance. Build and electrically test a prototype before volume manufacture.
## Private publishing
```bash
bun node_modules/tscircuit/cli.mjs push --private
```