This code defines React components representing various surface-mount and through-hole electronic components—such as resonators, microcontrollers, crystals, connectors, and push buttons—with detailed physical footprints, 3D models, and pin configurations for PCB design.
# MSP-EXP430FR2355 LaunchPad
A four-layer tscircuit recreation of TI's MSP-EXP430FR2355 LaunchPad development kit.
## Reference and implementation
- Reference: TI MSP-EXP430FR2355 LaunchPad Development Kit User's Guide, SLAU680.
- Target: production `MSP430FR2355TPTR`, LQFP-48.
- Two schematic sheets mirror TI's reference organization: eZ-FET/debug and target/BoosterPack circuitry.
- The exact 40-pin LaunchPad mapping, target, eZ-FET isolation, Grove connector, buttons, LEDs, 32.768 kHz crystal, ambient-light front end, USB protection, test points, and external power access are electrically represented.
- The original EnergyTrace switching supply is replaced by a conventional 3.3 V LDO. Programming/debugging and target operation remain usable; EnergyTrace current profiling is not implemented.
## Fabrication status
- Default tscircuit autorouter: 166 routed traces, no route errors or jumpers.
- Circuit JSON: zero error elements.
- Netlist, source, and PCB placement checks: zero errors.
- Gerber all-layer shorts check: no shorts detected.
- Four copper layers: front, two inner, and back.
- Minimum via hole: 0.30 mm; minimum via pad: 0.45 mm.
- Gerber archive contains copper, mask, paste, silkscreen, outline, plated drill, NPTH drill, BOM, and pick-and-place files.
Generated verification artifacts are under `dist/` after running `bunx tsci build` and `bunx tsci export`.