AnasSarkiz/muse-voice-remote

Muse Voice Remote — bare ESP32-S3R8, 155 TOP JLCPCB parts with real supplier CAD, native 3D assembly and GLB exports. Revised 17 mm case allocation; 0.30 mm via drill /0.45 mm pad. Checked prototype PCB; mechanical, RF and MUSE qualification pending.

Version
1.3.2
License
unset
Stars
0

manufacturing/gerbers/MuseVoiceRemote-factory-job.gbrjob

{
  "Header": {
    "GenerationSoftware": {
      "Vendor": "KiCad",
      "Application": "Pcbnew",
      "Version": "9.0.2+dfsg-1"
    },
    "CreationDate": "2026-10-14T18:30:21+00:00"
  },
  "GeneralSpecs": {
    "ProjectId": {
      "Name": "MuseVoiceRemote-factory",
      "GUID": "4d757365-566f-4696-9365-52656d6f7465",
      "Revision": "1.3.1"
    },
    "Size": {
      "X": 66.05,
      "Y": 48.05
    },
    "LayerNumber": 4,
    "BoardThickness": 1.0,
    "Finish": "ENIG",
    "ImpedanceControlled": true
  },
  "DesignRules": [
    {
      "Layers": "Outer",
      "PadToPad": 0.15,
      "PadToTrack": 0.15,
      "TrackToTrack": 0.15,
      "MinLineWidth": 0.15,
      "TrackToRegion": 0.15,
      "RegionToRegion": 0.15
    },
    {
      "Layers": "Inner",
      "PadToPad": 0.15,
      "PadToTrack": 0.15,
      "TrackToTrack": 0.15,
      "MinLineWidth": 0.15,
      "TrackToRegion": 0.15,
      "RegionToRegion": 0.15
    }
  ],
  "FilesAttributes": [
    {
      "Path": "MuseVoiceRemote-factory-F_Cu.gtl",
      "FileFunction": "Copper,L1,Top",
      "FilePolarity": "Positive"
    },
    {
      "Path": "MuseVoiceRemote-factory-In1_Cu.g1",
      "FileFunction": "Copper,L5,Inr",
      "FilePolarity": "Positive"
    },
    {
      "Path": "MuseVoiceRemote-factory-In2_Cu.g2",
      "FileFunction": "Copper,L7,Inr",
      "FilePolarity": "Positive"
    },
    {
      "Path": "MuseVoiceRemote-factory-B_Cu.gbl",
      "FileFunction": "Copper,L4,Bot",
      "FilePolarity": "Positive"
    },
    {
      "Path": "MuseVoiceRemote-factory-F_Paste.gtp",
      "FileFunction": "SolderPaste,Top",
      "FilePolarity": "Positive"
    },
    {
      "Path": "MuseVoiceRemote-factory-B_Paste.gbp",
      "FileFunction": "SolderPaste,Bot",
      "FilePolarity": "Positive"
    },
    {
      "Path": "MuseVoiceRemote-factory-F_Silkscreen.gto",
      "FileFunction": "Legend,Top",
      "FilePolarity": "Positive"
    },
    {
      "Path": "MuseVoiceRemote-factory-B_Silkscreen.gbo",
      "FileFunction": "Legend,Bot",
      "FilePolarity": "Positive"
    },
    {
      "Path": "MuseVoiceRemote-factory-F_Mask.gts",
      "FileFunction": "SolderMask,Top",
      "FilePolarity": "Negative"
    },
    {
      "Path": "MuseVoiceRemote-factory-B_Mask.gbs",
      "FileFunction": "SolderMask,Bot",
      "FilePolarity": "Negative"
    },
    {
      "Path": "MuseVoiceRemote-factory-Edge_Cuts.gm1",
      "FileFunction": "Profile",
      "FilePolarity": "Positive"
    }
  ],
  "MaterialStackup": [
    {
      "Type": "Legend",
      "Name": "Top Silk Screen"
    },
    {
      "Type": "SolderPaste",
      "Name": "Top Solder Paste"
    },
    {
      "Type": "SolderMask",
      "Thickness": 0.01,
      "Material": "Solder mask",
      "DielectricConstant": "3.8",
      "LossTangent": "0.02",
      "Name": "Top Solder Mask"
    },
    {
      "Type": "Copper",
      "Thickness": 0.035,
      "Name": "F.Cu"
    },
    {
      "Type": "Dielectric",
      "Thickness": 0.0994,
      "Material": "3313 RC57%",
      "DielectricConstant": "4.1",
      "LossTangent": "0.02",
      "Name": "F.Cu/In1.Cu",
      "Notes": "Type: dielectric layer 1 (from F.Cu to In1.Cu)"
    },
    {
      "Type": "Copper",
      "Thickness": 0.0152,
      "Name": "In1.Cu"
    },
    {
      "Type": "Dielectric",
      "Thickness": 0.7,
      "Material": "FR4",
      "DielectricConstant": "4.53",
      "LossTangent": "0.02",
      "Name": "In1.Cu/In2.Cu",
      "Notes": "Type: dielectric layer 2 (from In1.Cu to In2.Cu)"
    },
    {
      "Type": "Copper",
      "Thickness": 0.0152,
      "Name": "In2.Cu"
    },
    {
      "Type": "Dielectric",
      "Thickness": 0.0994,
      "Material": "3313 RC57%",
      "DielectricConstant": "4.1",
      "LossTangent": "0.02",
      "Name": "In2.Cu/B.Cu",
      "Notes": "Type: dielectric layer 3 (from In2.Cu to B.Cu)"
    },
    {
      "Type": "Copper",
      "Thickness": 0.035,
      "Name": "B.Cu"
    },
    {
      "Type": "SolderMask",
      "Thickness": 0.01,
      "Material": "Solder mask",
      "DielectricConstant": "3.8",
      "LossTangent": "0.02",
      "Name": "Bottom Solder Mask"
    },
    {
      "Type": "SolderPaste",
      "Name": "Bottom Solder Paste"
    },
    {
      "Type": "Legend",
      "Name": "Bottom Silk Screen"
    }
  ]
}