0hmX/am3352-zcz-footprint

This code defines the physical footprint and pin layout for an 18x18 ball grid array (BGA) package of a Texas Instruments AM3352 microprocessor, including pad positions and outline drawing commands for PCB design.

Version
1.0.2
License
unset
Stars
0

package.json

{
  "name": "@tsci/0hmX.am3352-zcz-footprint",
  "version": "1.0.2",
  "description": "AM3352 ZCZ0324A footprint only: 324 balls, 15x15mm body, 0.8mm pitch, 0.4mm pads",
  "main": "index.tsx",
  "keywords": [
    "tscircuit",
    "circuit",
    "pcb",
    "electronics"
  ],
  "scripts": {
    "dev": "tsci dev",
    "build": "tsci build",
    "snapshot": "tsci snapshot",
    "snapshot:update": "tsci snapshot --update",
    "start": "tsci dev",
    "typecheck": "tsc --noEmit"
  },
  "devDependencies": {
    "tscircuit": "0.0.2482",
    "typescript": "5.9.3"
  },
  "author": "0hmX",
  "files": [
    "index.tsx",
    "README.md",
    "tscircuit.config.json",
    "docs/kicad-vs-tscircuit.png",
    "docs/kicad-vs-tscircuit.svg"
  ]
}