techmannih/museview

A 50×35 mm USB‑C 5 V camera board combining an ESP32‑S3 module, M0031 parallel camera connector, buck/LDO power rails, USB/ESD protection, controls, status LED, and passives.

Version
0.1.18
License
unset
Stars
1

release/README.md

PCBPCB preview for release/README.md
SchematicSchematic preview for release/README.md
# MuseView V1 manufacturing handoff

**ORDER HOLD:** this package corrects the camera core to CAM_1V3, 1.296 V nominal (R8 25.5 kΩ / R9 40.2 kΩ). The previous 1.197 V package is superseded. Exact M0031 flex qualification and physical bring-up remain open; see `../docs/camera-mating.md`.

- `museview-v1-gerbers.zip`: four copper layers, solder masks/paste, silkscreen, outline, plated L1–L4 drills (all vias 0.30 mm drill / 0.60 mm pad) and nonplated drills. Generic exporter BOM/CPL are removed to avoid competing assembly files.
- `jlc-bom.csv` and `jlc-cpl.csv`: the authoritative 49-component **top-only** assembly pair. No bottom-side components. Board-center origin matches the Gerbers. Validate polarized-part rotations in JLC's placement preview.
- `schematic-usb.svg`, `schematic-power.svg`, `schematic-mcu.svg`, `schematic-camera.svg`: four readable vector schematic sheets.
- `pcb-top.svg`, `pcb-bottom.svg`, `pcb-top.png`: copper/placement views.
- `museview-v1-kicad.zip`: PCB, project, root plus four schematic sheets and 16 model files. Extract the whole archive; retain its `3dmodels/` tree.
- `museview-v1-step.zip` (extract `museview-v1.step`), `museview-v1.glb`, `3d.png`: assembled mechanical model, portable textured 3D model and preview. Camera is an external assembly item. The STEP is zipped because the cloud importer exceeds its 32 MiB RPC limit when copying the loose assembled model; component STEP/OBJ files are retained for rendering.
- `circuit.json`: exact verified tscircuit interchange/netlist/geometry; CAD URLs resolve relative to repository root.
- `camera-supply.json`: divider identities, tolerances, calculated DC/temperature bounds and 1.24–1.36 V limits.
- `verification.json`, `sha256.json`: verification evidence and artifact checksums.

J1 uses the supplied USB-C CAD origin correction: local Y = -2.3500289000000517 mm. The browser preview, GLB, KiCad model offset and assembled STEP all use this origin. The pinned STEP exporter otherwise recentres the model and ignores its explicit origin, so `scripts/align-usb-step.mjs` corrects only J1's mapped placement after export; handoff validation checks that placement. The footprint, BOM/CPL and routed copper are unchanged.

USB-C is 5 V only. Use the assembly, electrical review and bring-up documents in `../docs/`. Physical power/startup/USB/camera tests and manufacturer stackup/impedance review remain open. This package is an engineering prototype handoff, not a claim of measured production qualification.