mohan-bee/fitness-band-sensor-flex

manufacturing/MANUFACTURING_STATUS.md

# Rev B manufacturing handoff — 2026-10-22

Engineering file checks pass. Fabricator/assembler acceptance is pending. This package is for quoting, DFM review and a small bench-prototype run after that review; it is not an unconditional production approval.

## Verified on this release

- Both native KiCad boards were refilled and checked again: zero reported DRC violations and zero unconnected items. The project retains its recorded rule configuration; this does not mean every possible fabrication rule is checked.
- Native copper designs retain their previously recorded SHA-256 hashes. The manufacturing exports were regenerated from those native boards.
- 190 main-board and 41 flex-board SMT pad positions/named nets match the frozen source snapshots. Supply, charger pin-map, NC-pin, harness and bend-reserve assertions pass.
- Release snapshots now live under source-snapshots rather than mutable dist outputs. The manifest and packaging checks reject changed native boards or snapshots.
- U7 ordering code is MAX30102EFD+T in the source, frozen snapshot, BOM and assembly table, per the ADI datasheet ordering table, page 31. This changes procurement metadata only; it does not change the copper.
- BOM and placement reference sets contain 32 main-board and eight flex-board SMT parts. Assembly tables provide pad-1 coordinates; the assembler must approve its library rotations.

No hardware was manufactured or bench tested during these checks. Charging protection, thermal tracking, RF, optical measurements and enclosure fit remain first-article acceptance work described in ASSEMBLY_AND_BRINGUP.md.

## Fabricator and assembler acceptance required before fabrication

Please return a reviewed stack-up, layer mapping and assembly preview confirming:

1. Main: 50 × 24 × 0.8 mm FR4, four copper layers, 0.10 mm minimum width/space, 0.20/0.45 mm vias, separate NPTH holes, and the module antenna overhang/keepouts. Panel tooling must preserve that overhang.
2. Flex: 36 × 14 mm, 25 µm PI core, 18 µm copper each side, approximately 0.12 mm finished thickness, and 0.20/0.45 mm vias. These are smaller than the regular advertised 0.30/0.55 mm via process. Confirm the resulting 0.125 mm radial via annulus is accepted; do not infer acceptance from the separate component-PTH annular-ring row.
3. Positive top laser-coverlay openings, fully closed bottom coverlay, the three specified bottom stiffeners, 0.025 mm adhesive allowance and the no-adhesive/no-stiffener bend reserve. Custom Gerber roles are mapped in FABRICATION.md. Confirm treatment of deliberately exposed top copper/vias within merged component windows.
4. Flex panel/carrier with handling rails, fiducials and reflow support. Both boards are supplied as finished single-circuit outlines; panelization is a CAM/assembly operation, not included tooling geometry.
5. Exact BOM procurement, component packages, pin-1/polarity and placement rotations; QFN/LGA inspection capability; MCP73871 segmented EP paste and optical-sensor reflow handling. No substitutions are authorized by this package.

Any requested change to copper, vias, stack-up, bend, coverlay, stiffeners, footprint or component must return for engineering review and a new checked release. DFM acceptance has not been obtained and no order has been placed.

## References

- ADI ordering table: https://www.analog.com/media/en/technical-documentation/data-sheets/max30102.pdf
- JLCPCB capability table checked 2026-10-22: https://jlcpcb.com/capabilities/flex-pcb-capabilities

Published capabilities are a screening reference, not approval of these particular files. Fabrication acceptance and physical first-article validation remain separate gates.