imrishabh18/rp2040-motor-controller

reports/routing-refresh-review.md

# Routing repair verification

The local board builds successfully with the current tscircuit toolchain. Native DRC, explicit JLCPCB clearance checks and `tsci check shorts` report zero errors. The browser viewer renders the same copper geometry with no routing errors. This report describes the validated routing update prepared for publication to tscircuit.com.

## Changes

- Refreshed saved PCB terminal references for core 0.0.2032 and rebuilt routes against the actual current placement. The routing input guard remains enabled.
- Shortened bypass and ground connections to satisfy every declared decoupling-length limit. Repositioned nearby capacitors and passives where necessary.
- Moved the optional encoder's two bypass capacitors to the bottom beside the encoder and marked them DNP. Factory assembly remains 101 top-side parts; fitting the encoder later requires the chip and both capacitors.
- Repaired via spacing and copper clearances, including the motor bulk capacitor area, USB connector escape, transistor pads, connector through-hole pads and mounting rings.
- Preserved all eleven motor-current nets on top/bottom copper, widened winding traces where clearance permits, and retained the short package escapes. All six winding paths satisfy the existing length, neck-length, resistance-estimate and via-count regression limits.
- Preserved the original electrical net membership, four Kelvin sense branches and twelve supplier-imported DRV8825 thermal vias. No manual thermal-via array was added.

## Results on the final artifact

| Check | Result |
| --- | --- |
| `bun run build` | Pass |
| Native DRC / `tsci check` | 0 errors |
| Explicit JLCPCB pad, trace and via rules | 0 violations, including 0.15 mm power-to-pad clearance |
| `tsci check shorts dist/index/circuit.json --mode gerber --layer all` | No shorts detected |
| Independent physical copper audit | 0 shorts, split nets, unmapped elements, drill, edge or polygon-pad violations |
| Full four-layer ground connectivity | 1 connected network; 28 retained pours; no floating fragments |
| Kelvin routing | All four sense branches meet the shunt pads without sharing load-current copper outside those pads |
| Driver thermal-via export | 12 imported vias, solid inner/bottom ground contact, plated drills and bottom tenting verified |
| Exported Gerber mechanical clearances | 0 violations; four NPTH locators and eight USB plated slots verified |
| Circuit tests | 23 passed, 0 failed |
| TypeScript | Pass |
| Browser PCB viewer | 285 traces, 28 pours, 0 errors; copper geometry matches CLI build |

## Scope and remaining advisories

The PCB placement command reports ten orientation heuristics, with zero component/courtyard/pad overlap errors and zero placement DRC errors. The orientations are retained for the validated multilayer escapes; the heuristic considers unrouted connection directions. The schematic-placement command still reports the pre-existing D_PWR/R_PWR_LED orientation advisory. These reports are preserved in `pcb-placement.log` and `schematic-placement.log`; they are not claimed to be warning-free.

The full ground network is connected. Checking only top/bottom copper produces two groups because the low-current Q_STATUS_B LED ground return uses an inner-layer link. This is not a disconnected electrical net; the eleven motor-current nets still use outer-layer wires. The separate outer-only report is retained to make this distinction explicit.

There are 81 trace-width warnings across 27 routes, below the existing regression ceilings of 101 warnings / 34 routes. Narrow package escapes and existing requested-width warnings remain; no design rule or test limit was relaxed. Metadata and styling warnings also remain. Standard passive footprints are retained under the user's prior approval: 58 supplier-outline mismatch warnings concern these footprints. C_MOTOR_BULK / C5981428 still has no importable supplier footprint. Important imported IC/MCU/connector footprints have no supplier-footprint discrepancy reported by the final build.

The tests estimate copper resistance; they do not establish a measured motor-current or thermal rating. No powered hardware test was performed in this routing repair.

## Artifacts and integrity

- Circuit JSON: `dist/index/circuit.json`
- Gerbers and filtered assembly files: `dist/index/gerbers.zip`, `assembly-bom.csv`, `assembly-pick-and-place.csv`
- PCB images: `dist/pcb-top.png`, `dist/pcb-bottom.png`
- Dev server: http://localhost:3020/#file=index.circuit.tsx
- Circuit SHA-256: `e5202595aa4c10929f651206a45ae468966620d6bd001efa8dc505b09c02bee0`
- Gerber SHA-256: `9858b31fb035ec7f6df24b561da02a366e905e24cc2c1790ff267cb27b4c056b`

Detailed evidence: `validation.json`, `manufacturing-audit.json`, `ground-copper-connectivity.json`, `ground-copper-outer-connectivity.json`, `kelvin-connectivity.json`, `driver-thermal-vias.json`, `exported-clearances.json`, `viewer-verification.json`, `tests.log`, `shorts.log` and `tsci-check.log`.