hrithik18k/open-ring-flex

docs/VALIDATION.md

# Validation report — Open Ring JLCPCB flex adaptation

Validated 2026-10-26 using tscircuit 0.0.3016, @tscircuit/core 0.0.2203 and TypeScript 5.9.3.

Version 1.0.3 adds five native schematic sheets with 14 titled functional sections. Every sheet was rendered and visually inspected. A comparison against the prior release verifies that physical PCB geometry and source pin-to-net connectivity are unchanged; generated IDs, record order and copper traversal direction are normalized for this comparison.

Version 1.0.4 corrects the four inductor instances to native inductor component types. The datasheet regression check runs with the parts engine enabled and an unavailable datasheet service: the old imports request IC metadata, while the corrected imports make zero datasheet requests. The check passes both on local core 0.0.2203 and on the editor's reported core 0.0.2202. Circuit and pin checks remain enabled.

The native inductor primitive also moves the L1 and L3 PCB reference labels to avoid component overlaps. Copper, footprints and physical pin-to-net connections are identical to 1.0.3. The revision comparison allows only silkscreen text position changes; text, layer, size, rotation and every other PCB record remain checked. The strict full-geometry baseline is updated to the resulting native label placement.

| Check | Result |
| --- | --- |
| Full native build, index.circuit.tsx | Passed; zero circuit errors |
| Netlist check | Passed; 0 errors, 0 warnings |
| Schematic placement | Passed; no reported issues |
| PCB placement DRC | 0 errors, 0 warnings |
| Gerber-based shorts, default all layers | Passed; no shorts detected |
| TypeScript | Passed |
| Source pin mapping audit | 47 reference nets; no physical pin assigned to different nets |
| Assembly identity audit | 73 populated instances, 28 unique JLCPCB part IDs |
| Native routing | 193 copper paths, 137 vias; no duplicate via locations |

All 14 solder/test-pad and electrode features have doNotPlace assembly metadata and remain present as copper. The copper hash is unchanged by that metadata correction. VDDOUT has one endpoint in the reference design and remains intentionally unconnected; its reference mapping is preserved.

The placement analyzer also reports four heuristic capacitor-orientation suggestions (C1, C9, C28, C30). These compare pad connections with estimated routing directions. They are recorded as advisory suggestions: the complete routed copper passes actual contact/clearance DRC and the independent short check. No overlap, off-board, courtyard-conflict or pad-clearance placement violations remain. Other informational library warnings concern missing optional power/ground pin attributes, generic imported symbol reference prefixes, and missing courtyards on copper features. They do not establish hardware functionality.

The 191 general routing paths were generated by tscircuit's native autorouter and retained through its native saved-path API. Two crystal signal paths were redrawn on top using the same native path format. Two crystal ground paths were moved to bottom with native vias to resolve contacts with those signal paths. Paths are ordered by removing tree leaves so saved-phase endpoint validation remains consistent. No external routing engine or post-build circuit JSON edits were used.

## Practical limits

This is a software-validated development adaptation, not a tested ring or a fabrication-qualified release. It is larger than the original ring PCB (106 x 18 mm main strip, 106 x 28 mm overall with programming tabs), uses a uniform four-layer flex model, and does not reproduce the original selective six-layer rigid-flex stack. The larger touch MCU package was explicitly approved by the user to prioritize JLC parts.

The QFN package mapping, substituted flash capacity/JEDEC handling, crystal load calibration, RF matching/feed impedance and new touch electrode geometry require hardware bring-up. Firmware changes are not included. The fabricator must approve actual flex laminate, coverlay, stiffeners, bend zones and the advanced via/trace process. JLC catalogue/model IDs are verified imports; present procurement stock is not guaranteed.

See README.md, PROVENANCE.md, BOM.csv and HIGH_PRIORITY_BUGS.md for scope and evidence.