hrithik18k/open-ring-flex

A flexible wearable PCB integrating inductive battery charging, BLE control with SPI flash and 32 MHz crystal, SAM L10 capacitive touch/wear sensing, haptic MOSFET drive with a large capacitor bank, RF antenna matching, and SWD programming/test connectors.

Version
1.0.4
License
CC-BY-NC-SA-4.0
Stars
0

docs/PROVENANCE.md

# Source provenance and changes

Reference repository: https://github.com/stawiski/open-ring
Reference commit: e790915a3ad39254b58bed81f724e71705a08345
Input: hardware/ring/smart-ring-main.PcbDoc and smart-ring-main.SchDoc, checked against hardware/schematic_ring.pdf.
Parser used: altiumts 0.0.33. Netlist extraction reads physical pads and their Altium net/component indices. Source schematic records supply values and pin names. The six external solder pads and six copper sensor electrodes are explicitly added to the adapted netlist.

The new QFN SAM L10 mapping uses PAxx, supply and programming signal names, rather than reusing WLCSP ball numbers. The original power-chip ball names A1..E5 map to row-major imported pin1..pin25. Diode original pin1 is anode and maps to imported alias A (pin2); original pin2 is cathode and maps to alias K (pin1). Antenna land 1 is RF; lands 2 and 3 are ground. MOSFET uses aliases G/S/D. Crystal uses physical pin1/pin3 signals and pin2/pin4 ground.

VDDOUT is an intentionally unconnected output in the reference design. Its singleton reference net is retained in the mapping data, with no physical trace required. Copper uses native `<autoroutingphase pcbTracePaths>`: 191 paths produced by tscircuit's own autorouter, ordered from tree leaves to the root, plus two reviewed top-layer crystal paths. One clipped route endpoint was extended 0.0563 mm to its pad center for the saved-path API. No external router or post-build circuit-JSON edits are used.

Supplier IDs demonstrate catalogue identity and successful model import, not guaranteed current stock. Supplier availability queries issued warnings, so procurement availability remains unconfirmed. Imported models require manufacturer land-pattern review; W3008's land pattern and header insertion direction have explicit corrections.

In version 1.0.4, the MLZ1608N2R2LT000 (L1/L4, 2.2 uH) and LQP03TN3N3B02D (L2/L3, 3.3 nH) imports use native `<inductor>` elements instead of generic `<chip>` elements. Their imported JLC IDs, physical pad numbers, footprints, custom symbols and CAD models are retained. This prevents the hosted editor from requesting IC datasheet pin metadata for these passive parts.