gokul/flex-led-wristband

VALIDATION.txt

VALIDATION — 22 OCTOBER 2026 — REV 0.0.3

Status: design checked for JLCPCB prototype fabrication; factory CAM/assembly approval and physical prototype validation remain. Not a tested wearable product.

Toolchain: tscircuit0.0.3003; CLI0.1.2400; core0.0.2196; props0.0.708; checks0.0.262; local @tscircuit/capacity-autorouter0.0.999 (tscircuit/tscircuit-autorouter); Bun1.3.14.

Completed:
- TypeScript passes. Official build, local autorouting, SVG/3D and transpilation pass. Circuit JSON has zero errors. DRC checks stayed enabled.
- Four automatic schematic sections, no schX/schY. Schematic, PCB top/bottom, 3D and independent Gerber top/bottom inspected. Source and Gerber outlines use rounded corners; rectangular PCB preview boundary is not the fabrication outline.
- Manufacturer-authored IC, LED and switch pinout/package drawings reviewed. Corrections and references in FOOTPRINT_REVIEW.txt.
- KiCad CLI independent DRC: zero physical violations, zero unconnected items. Remaining33 lib_footprint_issues are missing generated tscircuit footprint-library-table notices, not copper/clearance/drill/outline/silkscreen failures. Raw report included.
- Gerbonara independently parses copper, masks, paste, silk, outline, stiffeners and drills. It warns about G90 after the Excellon header; drill coordinates/units parse correctly.
- Shapely measurements of exported coverlay geometry: minimum web0.55 mm (JLC target>=0.50), minimum via-hole edge to opening0.25 mm (JLC target>=0.20). Covered touch pad verified; bottom windows only switch locating holes.
- All56 via copper disks fit inside support polygons. Exported bottom copper does not intersect any bottom keepout, including bend spans and touch region. Outline valid; all stiffeners inside outline.
-25 SMT parts. Corrected SW1 body-centre placement(0,11). Assembly drawing and exact pin1/cathode coordinate CSV supplied. Supplier library rotations remain for assembler review.
- JLC-oriented ZIP names bottom stiffeners fr4b_0.4.gbr and pib_0.2.gbr. Centre stiffener0.40 mm (original0.30 mm replaced),30x30 mm; LED islands0.20 mm PI.
- Live JLCPCB flex quote form checked:0.12 mm option permits0.5 oz copper and disables rolled-annealed copper; electro-deposited copper specified. Other-EDA stiffeners require manual review according to quote form. No JLCPCB CAM report or order was obtained. Browser file-transfer integration failed before a successful upload could be confirmed; no online DFM pass is claimed.

Remaining limits:
- JLCPCB must approve actual flex/coverlay/stiffener stack and production files; ask for production-file confirmation. Confirm flex assembly carrier/fixture, exact part sourcing and placement rotations before PCBA. Generic exporter placement CSV is raw output; use assembly-placement.csv with orientation drawing for review.
- Circuit warnings are generic pad/switch representations, incomplete passive pin classifications, nonstandard reference names and nondefault sheet style; disclosed below. React also emits list-key warnings for mapped intrinsic elements. No physical checks suppressed.
-3D packages are approximations (especially switch); not enclosure-clearance verification.
- Protected external1S LiPo whose permitted charge current>=50 mA, insulated rigid enclosure and wire strain relief required. OFF during charging, off wrist. No onboard protection, temperature sensor or load sharing.
- Firmware not included. BRINGUP.txt describes unperformed electrical/firmware/touch/battery and mechanical tests. Continuous dynamic flex, fatigue, moisture and wearable insulation are not qualified.
- No boards were physically fabricated or tested. This release is not100% production approval.

Machine-readable results and SHA256 hashes: dist/manufacturing-checks.json.

Circuit warning counts: {"schematic_sheet_styling_warning": 1, "source_component_pins_underspecified_warning": 4, "source_no_ground_pin_defined_warning": 1, "source_no_power_pin_defined_warning": 1, "source_refdes_convention_warning": 9}