0hmX/am3352-ddr-track-c-stackup-wip-20261007

Saved native stackup-first preview: 11 DDR endpoint routes and 179 selected pad-to-plane joins. Matching and full-board connectivity incomplete. Not fabrication-ready.

Version: 0.0.2
License: unset
Stars: 0

data/interface-thermal-vias.json

[
  {
    "id": "interface_PHY_EP_thermal_0",
    "x": 39,
    "y": 14,
    "drill_mm": 0.2,
    "outer_mm": 0.45,
    "net": "GND",
    "process": "Filled/plugged and capped under exposed-pad solder; confirm with assembler",
    "source": "TI DP83825I Rev C package RMQ0024A example board layout, page97"
  },
  {
    "id": "interface_PHY_EP_thermal_3",
    "x": 39.7,
    "y": 13.3,
    "drill_mm": 0.2,
    "outer_mm": 0.45,
    "net": "GND",
    "process": "Filled/plugged and capped under exposed-pad solder; confirm with assembler",
    "source": "TI DP83825I Rev C package RMQ0024A example board layout, page97"
  }
]